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specifications
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Features
Open Frame
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Mounting Type
Surface Mount
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Type
BGA
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Operating Temperature
-55°C ~ 125°C
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Number of Positions or Pins (Grid)
576 (30 x 30)
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Termination
Solder
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Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Pitch - Mating
0.100" (2.54mm)
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Contact Finish - Mating
Gold
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Contact Finish Thickness - Mating
29.5µin (0.75µm)
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Contact Material - Mating
Beryllium Copper
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Pitch - Post
0.100" (2.54mm)
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Contact Finish - Post
Tin
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Contact Material - Post
Brass